Posts – eProcessor

Kucza, N., Porrmann, F., Stollenwerk, C., & Hagemeyer, J. (2025). Efficient Edge AI for Next Generation Smart Mirror Applications. IEEE Access, 1-1. https://doi.org/10.1109/ACCESS.2025.3574492

June 10, 2025

eProcessor’s application in a nutshell

March 4, 2025

Mika, K., Porrmann, F., Kucza, N., Griessl, R., & Hagemeyer, J. “RECS: A Scalable Platform for Heterogeneous Computing”. 2023 IEEE 36th International System-on-Chip Conference (SOCC),https://doi.org/10.1109/SOCC58585.2023.10256982

February 20, 2025

Jing Chen, Madhavan Manivannan, Bhavishya Goel and Miquel Pericàs, “SWEEP: Adaptive Task Scheduling for Exploring Energy Performance Trade-offs,” 2024 IEEE International Parallel and Distributed Processing Symposium (IPDPS), San Francisco, CA, USA, 2024, pp. 325-336, doi: 10.1109/IPDPS57955.2024.00036.

November 1, 2024

Chip-to-Chip (C2C) in a nutshell

February 23, 2024

M. Vázquez, M. W. Azhar and P. Trancoso, “Exploiting the Potential of Flexible Processing Units,” 2023 IEEE 35th International Symposium on Computer Architecture and High Performance Computing (SBAC-PAD), Porto Alegre, Brazil, 2023, pp. 34-45, doi: 10.1109/SBAC-PAD59825.2023.00013.

November 14, 2023

Max Doblas Font, Oscar Lostes-Cazorla, Quim Aguado-Puig, Nick Cebry, Pau Fontova, Christopher Batten, Santiago Marco-Sola, and Miquel Moreto. “GMX: Instruction Set Extensions for Fast, Scalable, and Efficient Genome Sequence Alignment.” 56th ACM/IEEE Int’l Symp. on Microarchitecture (MICRO), Oct. 2023.

November 14, 2023

This project has received funding from the European High-Performance Computing Joint Undertaking (JU) under grant agreement No 956702. The JU receives support from the European Union’s Horizon 2020 research and innovation programme and Spain, Sweden, Greece, Italy, France, Germany.

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Financed by the European Union – NextGeneration EU

Kucza, N., Porrmann, F., Stollenwerk, C., & Hagemeyer, J. (2025). Efficient Edge AI for Next Generation Smart Mirror Applications. IEEE Access, 1-1. https://doi.org/10.1109/ACCESS.2025.3574492

eProcessor’s application in a nutshell

Mika, K., Porrmann, F., Kucza, N., Griessl, R., & Hagemeyer, J. “RECS: A Scalable Platform for Heterogeneous Computing”. 2023 IEEE 36th International System-on-Chip Conference (SOCC),https://doi.org/10.1109/SOCC58585.2023.10256982

Task Scheduling in a nutshell

eProcessor is in ISC 2024

Chip-to-Chip (C2C) in a nutshell

eProcessor is in HiPEAC 2024

M. Vázquez, M. W. Azhar and P. Trancoso, “Exploiting the Potential of Flexible Processing Units,” 2023 IEEE 35th International Symposium on Computer Architecture and High Performance Computing (SBAC-PAD), Porto Alegre, Brazil, 2023, pp. 34-45, doi: 10.1109/SBAC-PAD59825.2023.00013.

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